Defect : Bridging

Process/machine information :

Board type – Single sided

Solderability protection – HASL

Flux carrier – Water

Preheat type – Forced Convection

Process solutions

• Conveyor speed too slow.a. Time over preheat too long causing flux to be burned
  off.

  b. Dwell time too long causing flux to be destroyed before
  exiting the wave.

• Topside board temp too low.
• Flux not active enough or solids percentage too
  low.
• Solder temperature too low.
• Use debridging knife to remove bridges.
• Not enough flux.

Board and design solutions

• Lead length too long.
• Lead length to pad size ratio incorrect.
• Component layout, orientation.
• Using solder thieves on inline connections will prevent
  bridging.
• Pad design/size.