Printing profile display screens

The software will print profiles only from within the profile display screens.  There are two print formats available.  Print Format #1 is the default.

Select the print button at the bottom of the screen to print a profile.  A print dialog box will appear.
See Figure 44. 

Print Format #1- Portrait (default setting)

Figure 44: Print Options Screen Print Format #1 – Portrait

Enter the Company Name and Site ID. Check the items you wish to include on your profile printout.

Pass/Fail Adds additional notation on printout to designate if the PWI is within user specified value.

Image/Logo Allows you to add a custom image (such as a logo) to the bottom left side of the printout

• Use Browse button to point to desired image (Note: only .bmp image can be used)

Press the Print button to print the report.

Press the Print Preview Button to display a preview of the report. See Figure 45.

Print Format # 1 Print Preview

Figure 45: Sample Print Preview for Report Format #1.  Report is printed in Portrait layout.
Includes the Company Name, Site ID, Date, Statistics, Profile Information, Setpoints,
Profile Graph, Statistic Limits and Profile Description.

Print Format #2- Landscape

Figure 46: Print Options Screen Print Format #2 – Landscape

Enter the Company Name and Engineer . Check the items you wish to include on your profile printout. See Figure 46. 

Press the Print button to print the report.

Press the Print preview button to display a preview of the report. See Figure 47.

Pass/Fail Adds additional notation on printout to designate if the PWI is within user specified value.

Memo Box Enables/Disables a Memo Box area for Draft, Review and Approval Signatures and Dates.

Image/Logo Allows you to add a custom image (such as a logo) to the bottom right side of the printout

• Use Browse button to point to desired image (Note: only .bmp image can be used)

Print Format # 2 Print Preview

Figure 47: Sample Print Preview for Report Format #2.  Report is printed in Landscape layout.
Includes the Company Name, Engineer, Date, Statistics, Process Window, Setpoints,
Profile Graph, Profile Description, Image/Logo Area and Memo Box Area

Note: Optionally, you can print the contents of any screen in the software by pressing F9 on your keyboard. The F9 function will not work while viewing the Profile Printout Setup dialog box.

Profile Expiration on Printouts

Some users want to ensure that the profile printouts are of up-to-date profiles. Using this feature allows you to set a time frame (in days) for a profile to be considered valid .

Configuration Exit the PS2G software Browse to the C:\Profiling Software 2G directory Run the PSConfig.exe<[CDATA[ ]]> Select the Profile Validity Expires in checkbox, and specify the number of days allowed Click Apply and OK

Examples

When enabled, and a printout is created after the defined number of days since the profile was run, the printouts will display the word EXPIRED in red, and also display the date in red, to easily identify the status of the profile:

Portrait Mode

Landscape Mode

Appendix A: Using optional software

The software functionality can be enhanced by several available options, including Navigator Power, Auto-Focus Power, Statistical Process Control, Live Data Output, Centralized Process Window Control, and Product Image TC Mapping. The sections that follow describe each of the options in detail.

The software options are distributed on and activated from a software key a removable USB dongle key that can be separately purchased from KIC. The software key installs in any open USB port. When connected, the software key enables the use of the functions associated with each software option.

Note: Do not connect the software key to the computer before installing the Profiler Software 2G application. During the software installation sequence, you will be prompted when to connect the software key to a USB port.

To check that the software key is working properly, start the software and display the Hardware Status screen. The options available on the connected key appear in the Software Key field.

If the message No software key found appears, the software does not detect the software key.  The problem might be with the USB port, the software key, or the software drivers.  The software key drivers install as part of the software installation so reinstallation of the base software will likely repair any driver related issues. 

Using Navigator Power for profile optimization

Figure 103: Optimization Tab

The Optimization Tab allows you to set the search functions of the Navigator Power Option.   The Navigator Power will search through millions of setpoint and conveyor speed combinations to find the optimal setting for each product.  This optimization is based on what options you select in this tab.

Original PWI The Process Window Index for the original profile

Best PWI The best Process Window Index that can be found based on the oven recipe optimization constraints selected.

Speed change The total change to the conveyor speed for the best oven recipe found.

Total setpoint change The sum of all setpoint changes for the best oven recipe found.

Search Mode for Optimization

• Minimize PWI Search for the combination of setpoint temperatures and conveyor speed that will minimize the Process Window Index.

• Allow zone setpoints to change This option will determine if Navigator will include zone setpoint changes when predicting new solutions.

• Allow conveyor speed to change – Choose whether to allow Navigator to vary the conveyor speed.  If you choose this feature, you can set the minimum and maximum speeds.

• Maximize conveyor speed Search for the setpoint temperatures that will maximize conveyor speed.

• Minimize energy consumption Search for the oven settings that will minimize the power consumption of the oven by finding setpoint solutions with slower conveyor speeds and lower temperature settings.

Conveyor speed constraints

As long as the Allow Conveyor Speed to Change feature is selected, these options will be available.

Minimum Select the minimum conveyor speed you want to allow.

Maximum – Select the maximum conveyor speed you want to allow.

Using Auto-Focus Power

If you have Auto-Focus Power available through the software key, its settings appear on the Auto-Focus tab that is part of the Global Preferences.

Figure 104: Global Preferences Auto Focus Tab

Selecting profile optimization settings

Search Mode for Auto-Focus

• Minimize PWI Search for the combination of setpoint temperatures and conveyor speed that will minimize the Process Window Index (PWI).

• Allow zone setpoints to change This option will determine if Auto-Focus will include zone setpoint changes when predicting new solutions.

• Allow conveyor speed to change – Choose whether to allow Auto-Focus to vary the conveyor speed.  If you choose Allow to Vary you can set the minimum and maximum.

• Maximize conveyor speed Search for the setpoint temperatures that will maximize conveyor speed.

• Minimize energy consumption Search for the oven settings that will minimize the power consumpotion of the oven by finding setpoint solucitons with slower conveyor speeds and lower temperature settings.

Conveyor speed constraints

Minimum Select the minimum conveyor speed you want to allow.

Maximum – Select the maximum conveyor speed you want to allow.

Setting product dimensions for Auto-Focus

Figure 105: Run a Profile Auto Focus screen #1

If you have purchased the Auto-Focus software option, this screen will appear. Enter the length, width, and weight of your product, and then choose the Forward Arrow button. See Figure 105. 

• This product will be included in the Auto-Focus library from this point forward.

• Make sure to measure using the correct units of measurement.

Auto-Focus confirm screen

If you select YES, you will be prompted to Confirm the First Guess Recipe. See Figure 110. 

Figure 110: Run a Profile Auto Focus screen #3

Confirm the recipe and select the Forward Arrow button. If there is no communication with the oven controller, the following dialog box appears: You must manually enter the recipe information on the oven. See Figure 111. 

Figure 111

If there is communication with the oven, then the recipe is copied directly to the oven.

Using SPC – Statistical Process Control data

The Statistical Process Control (SPC) option uses profile data to chart Process Capability Index (Cpk) values.

When the software detects the SPC option on the key, the SPC column appears in the Profile Explorer screen:

Figure 112: Profiler Explorer SPC Option

To view a product s chart(s) and/or SPC data:

1. Select a product folder. 
2. In the SPC column select the profiles to be charted by clicking the check box for each profile.  (The maximum number of boards that can be selected for SPC charting is 35.)Note: MVP Users – Select either Baseline profiles or Virtual Profiles since the software can only chart one type of profile at any given time.

3. Next, select the Show Charts button. 
4. The charts for the selected profiles will be displayed in a full screen format. 

A checkbox is available for turning on/off the display of the mini-SPC Charts in Profile Explorer.

SPC chart display

Figure 113: SPC Option Chart Display

The Chart tab will display a control chart for the overall profile PWI and for each individual process specification with upper and lower alarm limits as defined in the Process Window setup.  The chart data will coincide with the stored profile data for the selected board, date and time.

The control charts hold all of the historical profile data for your product as selected in the Profile Explorer SPC column.  Each chart contains data for every product thermocouple used during the profile. 

Selector Line – Each chart has a Selector Line.  The Board or Profile # will be displayed at the top of the screen; along with the date and time that profile was run.  You can move the Selector line position by clicking and dragging the small triangle at the bottom of the Selector line in any chart window.

The Maximum PWI and Cpk for the selected board, date and time will be highlighted above the corresponding chart(s).  In the bottom-left corner of the screen, the PWI for the selected profile is displayed.

Chart display controller

Select the Chart Display Controller button (Upper-Right Corner) to:

1. Select the number of control charts to display
2. Enable/Disable Cpk. 
3. Edit the minimum and maximum number of data points to calculate SPC (Cpk) data for the selected product. 

Figure 114: SPC Option – Chart Display, Full Screen

Viewing chart data

To view individual chart data, select a chart and then click inside the chart area.  This will display that particular chart in a full screen format. 

Figure 115: SPC Option – Chart Display, Full Screen

Move the mouse pointer over the chart data, and a Display Info box will appear.  This Display Info box data includes PWI, Cpk, date, and time for each board. 

• Meter window Right click anywhere in the full screen chart area.  A menu will appear, select Meter Window.  This will display a small data box in the upper-left corner of the profile graph.  This data box will display the historical statistic data for any selected board.  To select a board move your mouse pointer along the chart data, at each data point the historical statistic data for that board will be displayed.  Right-click in the chart area again and de-select Meter Window to disable this feature.

• Point protector When this feature is enabled, the charts will display individual data points for each board. To activate this feature right click anywhere in the full-screen chart area. A menu will appear, select Point Protector. This will display the individual data points on each control chart. De-selecting this feature will remove the data points from the control chart, showing only a plot of the same data. By default, the Point Protector will be enabled for charts containing 20 boards or less. Click in the full screen chart area again to return to the regular Chart tab view.

SPC charting for SRA data<[CDATA[ ]]>

In addition to the charting described above, when using an SRA Smart Reflow Analyzer you can track the stability over time of various machine related parameters. Additional tabs will be displayed on the main chart tab when viewing data from the SRA.

Note: Specifications must be selected, and limits defined, in a Process Window to view the SPC charting with SRA data.:

• Reflow Specifications This tab will display a control chart for the overall profile PWI and for each individual process specification with upper and lower alarm limits as defined in the Process Window setup. The chart data will coincide with the stored profile data for the selected run, date and time.
• Conveyor Speed This tab will display a control chart for the measured Conveyor Speed for each run, with upper and lower limits displayed as defined in the Process Window setup.
• Zone tabs There will be separate tabs displaying the SRA specific calculations for each zone. The number of Zone tabs displayed (heated and cooling) will be based on the oven configuration file selected when the runs were collected.

The Reflow Specifications SPC charts will calculate and display Cpk calculations for the selected specifications as these are process related variables. The Conveyor Speed and individual Zone charts will display Cm and Cmk calculations for the selected specifications as these are machine related variables.

Using Live Data Output (LDO)

The Live Data Output, or LDO, option allows you to automatically create an external data and/or image file for a profile. The data file can be used by third-party applications such as Line Balancing/Production Monitoring Host or external SPC software. The data includes all relevant profile data, statistics, and limits. The image output function provides users an automatically created picture of the completed profile.

Note: For the Live Data output to function, the appropriately programmed USB dongle key must remain connected to the PC at all times during use. You can verify if you have the LDO feature by viewing the Software Key panel in the Hardware Status screen.

Configuration The LDO option is enabled in the PSConfig.exe utility.   Shut down the PS2G software Browse to the C:\Profiling Software 2G directory Run the PSConfig.exe file Select the LDO tab   <[CDATA[ ]]>Image Output Select to generate an image file each time a profile is downloaded. Click the Browse button to select a directory where the image files should be saved. Select the type of image file.   <[CDATA[ ]]>Data Output Select to generate an external data file each time a profile is downloaded. Click the Browse button to select a directory where the data files should be saved. Select the type of data file.   Click OK to save and close the utility

The format of the Image Output file is based on the Printout preferences set. To change the layout between either Portrait or Landscape mode, see the Printing profile display screens section of this manual.

Operation

Output of the LDO file When downloading of a profile is completed, the data and/or image files are automatically created and saved to the directory specified by the user.

Viewing LDO data The LDO output files can be generated in commonly used file formats: .csv, .txt, or .xml for data files; .png or .jpeg for image files.

Note: For the Live Data output to function, the appropriately programmed USB dongle key must remain connected to the PC at all times during use. You can verify if you have the LDO feature by viewing the Software Key panel in the Hardware Status screen.

Examples of data output file

Centralized Process Window Control

This optional feature enables a customer to ensure that every instance of the software is always using the same Process Window files and prevents unauthorized editing of specifications.

Some factories may have multiple PCs across the production floor where they run profiles from, and the same Process Windows may need to be used at any one of those PCs. This can lead to mistakes being made when transferring files from one machine to another. Or, someone may make a change to a specification on one machine, and the change may not be made on others or the updated file is not copied to all other software. This can lead to varying profile results depending on which PC the data is collected in.

This feature eliminates these situations by centralizing the creation and editing of Process Window files through the use of a separate application, accessible only by authorized personnel. All Process Window files reside in a specified central directory, and each instance of the Profiling Software 2G get their Process Windows from this location. Additionally, all creation and editing functions within the PS2G software are disabled. This ensures that no matter who is running the profile or at which location, the correct, approved Process Window specifications are the only ones shown.

Note: For the Centralized Process Window Control to function, the appropriately programmed USB dongle key must remain connected to the PC at all times during use. You can verify if you have the optional feature by viewing the Software Key panel in the Hardware Status screen.

Additionally, each instance of the PS2G software that you want to use this option on must be connected to your company network and have access to the directory where the Process Windows are saved.

KIC File Administrator

The KIC File Administrator is the application that will be used for creating and editing Process Windows for use with the Centralized Process Window Control option.

Note: For the KIC File Administrator (or KFA) to function, the appropriately programmed USB dongle key must remain connected to the PC at all times during use. Only authorized users should be allowed to have access to this application.

As an added protection, this application requires a password for use. The default password is Admin, but can be changed in the Settings menu after logging in.

Login/Logout Allows you to display or deactivate all areas of the application.

Change Specs Name Allows a user to change the name of a specification. See Change Specs Name section below for details.

Settings Used for setting units of measure (for this application), changing password, inactivity time-out, etc.

Working Directory This is the network location where you will be saving/storing the Process Window files. By default, it will show the path where the KFA application is located. Use the Browse button to point to the desired network directory.

Convert Old PW files This section is used for updating existing Process Window files for compatibility* with the Centralized Process Window Control option.

Drop-down menu Displays list of currently available Process Window files. User can also type in a new name if creating a new Process Window.

OK Saves any changes and closes application

Cancel Ignores any changes made and closes application

Apply Saves changes and keeps open the application

*The Centralized Process Window Control option uses a unique file format for Process Windows. When the option is in use, the PS2G will only read Process Window files that were created or converted using the KIC File Administrator application. Standard Process Window files will not be recognized by the PS2G software when this option is enabled.

Working Directory

As this is the network location where the Process Window files will be stored, and ALL PS2G software installations will need to access this directory, you may need to contact your IT department to identify a proper location for this directory.

Once a network directory is identified, click on the Browse button to select the location. Click OK in the selection window, then click Apply to save the change. Two subfolders named Ovens and ProcessSpecs will automatically be generated in the specified directory. All new Process Windows created, and any existing ones that are converted to the compatible format, will be saved into the ProcessSpecs folder of this Working Directory location.

Convert Old PW files

This section enables you to easily convert any existing Process Window files you already have into the updated format so they can be used with the Centralized Process Window Control option. To update existing files:

Click on the Browse button and point to the ProcessSpecs sub-folder of a Profiling Software 2G directory. Click the Apply button. All Process Windows files (.PSProcessSpec) will be automatically copied, converted into the new format (.CentralProcessSpec), and then pasted into the ProcessSpecs folder of the Working Directory on the network. To ensure all of your Process Windows are updated and available, repeat these same steps for each PC where you have the PS2G software installed.

Change Spec Name This functionality is available for users who need to customize the name of a given specification to meet their internal naming conventions for process specifications. The updated name is what will display in the PS2G Process Windows. If you need to change a specification, check the Use Change Specs Name checkbox. From the left side columns (greyed out), locate the specification names you want to modify and type the new name into the corresponding right side column. Click Save then Exit when you ve completed your changes.

For SRA Users Only<[CDATA[ ]]>

As the Process Window files used for SRA are linked to your specific oven configuration files, you must copy the Ovens folder from the C:\Profiling Software 2G directory into the C:\KIC File Administrator directory in order to use the KFA application to create or edit SRA Process Window files. The same Link To drop-down menu (see SRA section of this manual for details) will appear to select which oven configuration file to associate it with.

Configuration of PS2G software

To use the Centralized Process Window Control option in the PS2G software, a selection needs to be made during the software installation. This will automatically configure the software to use this function. A message will appear on the screen asking if you wish to enable this functionality:

NOTE: Only select the checkbox if you have purchased the Centralized Process Window Control option and want to implement the capability in the software.

After installation of the PS2G software is completed, you will also need to specify the network directory where the Process Window files will be retrieved from. This will be done through the PSConfig.exe utility.

Shut down the PS2G software Browse to the C:\Profiling Software 2G directory Run the PSConfig.exe file In the Process Window Directory section, click Browse and select the ProcessSpecs folder in the network drive previously specified in the KFA utility Click Apply and OK to save the changes and close the utility

Operation of PS2G software

When the Centralized Process Window option is in use, the PS2G software will populate the drop-down menu at the top of the screen with only the Process Window files from the specified network directory. All edit and naming functions are removed. The user can only view the Process Window files.

The Process Window files will automatically be downloaded into the local PS2G directory from the specified network location. This ensures that whenever a Process Window needs to be accessed either from opening the Process Window screen, or from the Run a Profile screen the most up-to-date version of the Process Windows are always being used.

Note: For the Centralized Process Window Control to function, the appropriately programmed USB dongle key must remain connected to the PC at all times during use. You can verify if you have the optional feature by viewing the Software Key panel in the Hardware Status screen.

Additionally, each instance of the PS2G software that you want to use this option on must be connected to your company network and have access to the directory where the Process Windows are saved.

Appendix B: Writing data over a network

The software can easily be configured to write the collected data directly to a network drive location.  This allows data from one or even multiple systems to be stored in one centralized location (Server/Shared Hard Drive).

You must have a mapped network drive on the PC running the software to the desired network location.  Due to the varieties of OS and network configurations, KIC cannot detail this step.  We recommend you contact your IT/Network administrator if you need assistance setting up a mapped network drive.

Once you have mapped the drive, select a folder on the network drive and copy in the following folders from the C:\Profiling Software 2G directory Ovens, Process Specs, and Profiles. Once completed follow the steps below on the PC where the software is installed:

1. Ensure the software is shutdown.  Open Windows Explorer, and locate the file:
   C:\Profiling Software 2G\Log\PSDataPath.kiccfg

2. Double‑click on the PSDataPath.kiccfg to open it in Notepad.  See Figure 116: 

Figure 116

3. Change the line AllowUserToManuallyChangeWorkingDataPathInThisIniFile=0 to the value =1.  See Figure 117. 

Figure 117

4. Change the KIC2000DefaultDataPath= to the desired network location. See Figure 118.

Figure 118

5. Once the PSDataPath.kiccfg file has been modified with the new locations, choose File/Save from the drop down menu to save the changes.

6. Close Windows Explorer and start the software.

7. With the software running, go into Profile Explorer.  You should now see the new data path directory displayed in the upper right hand corner of the screen.  See Figure 119. 

Figure 119

All data generated (oven files and process specs) and collected (profiles) will be written directly to the specified network directory. You can now view the collected data from any PC on the network that is running the software.

If the network is unavailable when accessing various areas of the software (Define/Edit Process Window, Run A Profile, Profile Explorer), a message will appear alerting you to the issue:

When this occurs, you are still able to use the software. It will temporarily reset back to the local install directory and any new files generated or updated will be saved in the local directory (C:\Profiling Software 2G). If the network connection is re-established, the Profiling Software 2G software must be restarted to begin writing directly to the network directory again.

Any data that was collected while the software was offline will be moved to the network directory after the connection has been re-established and the Profiling Software 2G software is restarted.

Appendix C: Using the Process Window Index to quantify thermal profile performance

The problem

While there are currently statistically valid methods for quantifying pick and place and screen printer performance, there is no widely accepted method for comparing performance of thermal profiles, and thus, no quantifiable system of ranking thermal process performance.  Once a thermal profile has been run, it is judged as being either in or out of spec, and perhaps subjectively judged as being OK, good, or really good.  Efforts to track process performance for SPC or QC generally focus on a single, or a small group, of profile statistics; for example, peak temperature of one or two thermocouples on a golden board.  The Process Window Index is a statistical method for ranking thermal profile and thermal process performance.

Defining the Process Window Index

The PWI tells users exactly how much of their process window a given profile uses, and thus how robust that profile is.  The lower the PWI, the better the profile.  A PWI of 99% is risky because it indicates that the process could easily drift out of control.  Most users seek a PWI of below 80%, and profiles with a Process Window Index between 50% and 60% are commonly achieved (if the oven is sufficiently flexible and efficient).

Figure 121 shows the Process Window Index for the Peak Temperature of a single thermocouple. The Process Window Index for a complete set of profile statistics is calculated as the worst case (highest number) in the set of statistics.

For example: if a profile is run with six thermocouples, and four profile statistics are logged for each thermocouple, then there will be a set of twenty-four statistics for that profile, and the PWI will be the worst case (highest number expressed as a percentage) in that set of profile statistics. Note that Figure 122 shows the user-designated critical statistics for a single thermocouple.

Figure 122: The Process Window Index
(Multiple Statistics for a Single Thermocouple and Final PWI Calculation)

Calculating the PWI

To calculate the Process Window Index: i=1 to N (number of thermocouples); j=1 to M (number of statistics per thermocouple); measured_value_[i,j] is the [i,j]^th statistic s value; average_limits_[i,j] is the average of the [i,j]^th statistic s high and low limits; and range_[i,j] is the [i,j]^th statistic s high limit minus the low limit.

Figure 123: Formula for calculating the PWI

Thus, the PWI calculation includes all thermocouple statistics for all thermocouples.  The profile PWI is the worst case profile statistic (maximum, or highest percentage of the process window used), and all other values are less.

Note: When using non-centered Target values, a modified formula is used.

Benefits of ranking thermal profile performance

The analysis of thermal profiles with the Process Window Index offers four significant benefits.  The first is that profiles can be easily compared, and users can be confident that they are using the best profile their process can achieve.  Before the PWI was available for profile analysis, comparing profiles was subjective, and users could never be certain they had the best profile for their product.  The PWI provides an excellent opportunity for process improvement and its use is a significant step towards Zero-defect Production.

The second benefit is that the PWI greatly simplifies the profiling process.  When used in advanced profiling tools, all profile statistics are reduced to a single number (the PWI) that even the most inexperienced operator can understand.  This means significant savings in terms of training costs and a reduction in defects caused by operator error.  It further means that in a few minutes, an inexperienced operator can setup an oven with the optimal profile, a job that formerly could take an experienced engineer hours.

The third benefit is that because the PWI reflects the performance of the whole profile, it provides much better indicator of process capability than tracking a single statistic.  The PWI thus provides excellent data for SPC and other QC monitoring programs while simplifying data gathering and reducing process monitoring costs.

Finally, the PWI gives users a simple method for comparing thermal process performance.  Comparisons may be made between individual lines on the shop floor, between processes at multiple plants, and between processes using dissimilar equipment.  The ability to quantify thermal process performance will give electronics assemblers a means for comparing the performance of their soldering equipment.  This is of value in selecting equipment, for buy off, and for process troubleshooting.

Table 1 is the result of a series of tests comparing oven performance using several sizes of PCBs.  Each board was profiled in the given oven, and then an automated profile prediction tool was used to find the optimal profile for that board in the given oven.  After the oven setpoints were changed and the oven stabilized, a second profile was run to confirm that the predicted PWI had been achieved.  Table 1 shows that there is significant variation in oven performance between various makes and models.  In this test, Oven C had more zones than Ovens A and B, and performed better, as would be expected.

Table 1: Comparison of Oven Performance Best Achievable PWI

Conclusion

The simplicity of the Process Window Index makes its validity as a statistical tool readily apparent and its adoption as an industry standard clearly offers a significant opportunity for the improvement of the soldering process. The advantages detailed above point to its value in demystifying the soldering process and open the door to precision control of a process that has been ignored for too long. Issues like Lead-free electronic assembly mean that electronics assemblers can no longer be complacent about their soldering process. Sophisticated tools utilizing the PWI as a standard for accurately measuring the thermal process will mean more efficient production, improved and simplified process control, and higher quality final product.

Using the SRA Smart Reflow Analyzer

The SRA Smart Reflow Analyzer is an optional fixture specifically designed for collecting machine related data which allows you to analyze and track machine stability from run to run, and over time, and for various oven verification purposes.   The SRA uses six embedded thermocouples three Air TCs and three Mass TCs which collect a variety of data for each oven zone such as measured zone temperatures and side to side uniformity. With the use of the SRA, you will also be able to identify changes in heat transfer in a zone over time, through the display of HTI (Heat Transfer Index). It also utilizes the latest in laser sensor technology to automatically calculate conveyor speed each time you run it through your machine.

SRA Smart Reflow Analyzer

It has a built-in data collection module, so there is no need for a separate profiler.

The device is used to routinely check the performance of your machine. Using a variety of available specifications, the machine s performance is measured each time a pass is made based on your selected Process Window. The included SPC charting feature allows you to track the performance of individual zones, based on specifications selected.

For additional details on the SRA Smart Reflow Fixture hardware, consult the following publication:

• SRA Smart Reflow Analyzer Hardware Guide, (Publication Number SRA-330200-000)

Configuration

The following sections will outline the steps necessary to setup and run a profile using your SRA fixture. They are written assuming you have a basic understanding of the software and its functions before attempting to run profiles.

Enable SRA Features To enable the SRA functionality in the software: Exit the Profiling Software 2G Browse to the C:\Profiling Software 2G directory Open the PSConfig.exe application Select Enable SRA Features Click Apply and OK to save and close the application
Global Preferences Maximum product temperature at start of profile This setting will determine the maximum temperature before the software allows you to start a profile. If any of the thermocouples in the device measure above this setting, the software will not allow you to proceed. This feature helps you to collect consistent profile data by always beginning the profile with the same or nearly the same device temperatures.   The software also uses this setting to determine when the data collection begins. The profile start temperature trigger is always set 2 C above the Maximum product temperature at start of profile . If the maximum product temperature at start of profile is set to 35 C (default for the SRA), the profile start temperature trigger is automatically set to 37 C. When the Air TCs read above 37 C, the data collection will begin.

NOTE: When the SRA is detected by the software, this setting will only apply specifically to the SRA device. When a profiler is detected by the software, such as an SPS, X⁵, or K², the value set will only apply to profiler usage. This allows you to use different triggers for fixture use and standard product profiling.

Running an SRA profile

• • Select or enter a name from the Product Name list. When using the SRA it is recommended that you use the oven recipe name for this field. That will allow you to easily identify runs by machine setup.
  • Select Smart Reflow Analyzer from the Application drop-down list. The software profile results are based on this setting. It is imperative that your select the correct Application type, as this configures the software for the proper type of data collection. Failing to do so can affect the profile results.

Note: When the Smart Reflow Analyzer application type is selected, the Process Window selection will disappear. The selection for the Process Window will be made on a different screen.

• • Optional: Select the Sample Rate from the drop-down list to adjust, or just leave the default settings.
  • Select your oven name from the list. If you re profiling a new oven or machine, type the name in the Oven Name field.

NOTE: If you are running the software on an oven controller computer that is communication compatible with the software, the number of zones is already known and the oven name will be entered in the Global Preferences screen, not on this screen. Additionally, the Zone length, and Minimum/Maximum temperature settings described on the following page will also be accessed from the Global Preferences screen.

• Optionally you can type notes or descriptions for this profile in the Profile Description field. These notes will be stored with the data and can be edited later if necessary,
• When you are finished with your selection, choose the Forward Arrow button to proceed.

Zone length, Minimum and Maximum temperature settings

When using the SRA, the software requires you to enter the length of each zone as well as the minimum and maximum zone temperature settings. With the SRA, you will be seeing data calculations per zone. If you wish to include data from the cooling section of your machine, you must specify the number of Cooling Zones and measurements for each.   Once you have finished entering this information select the Forward Arrow button to continue.

Entering temperature setpoints and conveyor speed

If your process requires different top and bottom setpoints, deselect the check box labeled Top and Bottom setpoints are the same. This will allow you to enter different values for top and bottom heaters in each zone. If your oven has top and bottom heaters, but not in all of the heated zones, just enter the same value as the actual setpoint in that zone for both the top and bottom setting. Use the scroll bar below the setpoints to enter settings for additional zones not shown including cooling zones. NOTE: If your software is installed and communicating with an oven controller software, the heated setpoints and speed will automatically be filled in. You will need to manually enter the setpoint for any defined Cooling zones. This screen is also where you will enter the Conveyor Speed setpoint. When you have finished entering this information select the Forward Arrow button to continue.

Selecting a Process Window

The next screen is where you will select a Process Window to apply to the data. For the first few runs with the SRA, you will not necessarily know what the upper and lower limits for the different specifications should be for a given machine. In this case, you can select None and the data collected will simply be displayed with no reference to an in-spec or out-of-spec condition. You can also choose to create a new Process Window by clicking the Create a new Process Window button or select an existing one from the list if one had already been defined.   NOTE: Only Process Windows associated to the oven chosen will be displayed in the drop-down menu.

Creating a New Process Window

If you chose to create a new Process Window, you will be brought to the Define/Edit Process Window screen. Ensure the Fixture checkbox is selected. Enter a new name in the Process Window Name field. You will then select which ovens this Process Window will be linked to. Click the Oven Name drop-down menu to display the oven files you ve created and put a checkmark next to each one that you want associated with this Process Window.   NOTE: You can only select multiple ovens if each have the same number of heated and cooling zones.

Click the Edit Specs button to define the upper and lower limits for your specs. Clicking the drop-down menu will display all the available specs. At the top of the list are the SRA specific specs. To assign spec limits, put a checkmark next to a desired spec and then enter the desired value/range. You will notice for several of the specs, there are tabs for each of the defined zones (based on the oven you linked). You can apply the same limits to ALL zones by clicking the button. Or you can click a zone tab to set different limits for different areas of the machine.   Below the SRA specific specs, you will find a list of common reflow specifications. If you select any of these, the specifications chosen will only be calculated for the Mass TCs.   NOTE: The software does not contain pre-defined specification limits for the fixture specific calculations. This will be determined by you after several runs and identifying what is the normal or acceptable amount of range and variation in your machine.   After defining your desired specifications/limits, click the green check mark to return to the main Process Window screen. Click the green checkmark on the main Process Window screen to save your changes. You will be returned to the Select a Process Window screen of the Run a Profile sequence. Arrow forward to continue.

Starting an SRA profile

This screen displays the live readings from the SRA for all channels selected. All six channels are enabled by default. A minimum of two (2) Air TCs and two (2) Mass TCs must be enabled to collect data. If a channel is not reading correctly, it can be turned off by unchecking the box above the channel.

Conveyor Speed sensor A display box will show whether the two speed sensors are operating properly. Green means it is ready; Red means there is a problem with one or both sensors. If Red, try cleaning the lenses on the SRA module and thermal shield.

Select the Start Profile (green traffic light) button to begin profiling.

Viewing the live profile graph

The live profile graph display only appears when you re using the device in Wi-Fi mode – not as a datalogger. The live profile graph display will show the profile plot on the graph for the current profile that is running.

While the device is in the oven, and until the profile has ended, the software will continue to display the live profile graph. The other tabs at the top of the screen; Description, and Comparison are inaccessible.

• The live profile is plotted on the graph.
• The current temperatures for each thermocouple and the Delta between them are displayed in a small window in the upper-left hand corner of the profile graph. The elapsed time is also displayed.
• The current oven temperature setpoints and conveyor speed for this profile are displayed beneath the statistics table.
• The profile status is continuously updated throughout the profile. Wireless models only.

The Live profile graph display will remain on your screen until the SRA has achieved the trigger temperature that determines the profile end.

Profile retransmission

Retransmission is only available in SRA models with Wi-Fi transmit capability.

While the device transmits the live profile data to the Smart Dock, it simultaneously stores the profile data in its memory.

Once the device detects that all the thermocouples have cooled below the profile-end trigger temperature, it will begin retransmitting the profile data to the software via Wi-Fi. The device will send the profile in data packets. The retransmission status is displayed at the bottom of the screen.

When all the data packets have been received, the software will display a message asking if you want to put the device to sleep. Selecting Yes will turn off the SRA; if you select No, the SRA will remain on.

Next, the software automatically analyzes the data and presents the completed data plot and all statistical measurements.

SRA Profile graph display

General tab

The top of the screen shows the data plot for all selected channels and representations of the defined zones:

A floating window displays information about the Conveyor Speed including:   Setpoint value entered from oven recipe Measured as measured by SRA sensors Delta Difference between setpoint and measured

Avg Temps By Zone tab

This tab will show the average measured temperature for all 6 embedded TCs (Air and Mass). The data is displayed for each zone and includes the Uniformity or Delta T (Temperature) across the embedded TCs per zone.

Any value within the defined specification will display in Green; any value outside the defined specification will display in Red. If no specifications were defined in the Process Window, all statistical calculations will be displayed in Black color

Reflow Specifications tab

If when creating a Process Window, you selected any of variables from the Reflow Specifications section, those calculations will be displayed here. For any specification chosen, it will display the measured value, along with the corresponding PWI for that measured value. As noted in the Edit Specs screen area, a PWI will only be calculated for the Mass TCs.

Oven Recipe; Measured vs Setpoint; HTI

At the bottom of the screen is additional information including:

Original Top/Original Bottom This area displays the oven recipe settings used in this run (Zone Setpoints and Conveyor Speed).

Average Measured Air Temperature This is the average value of all three of the Air TC readings for each zone

Delta T This is the temperature difference between the zone setpoint, and the Average Measured Air Temperature for each zone.

Heat Transfer Index (HTI) This is a calculation which allows you to quantify the performance and/or consistency of a zone. In the heated zones, a value of 0.00 indicates no thermal energy is being transferred into a part; a value of 1.00 indicates the maximum amount of thermal energy is being transferred. In a cooling zone, the range is reversed from 0.00 to -1.00 .

Bar Graph tab

This screen will display a graphical representation of three key parameters measured from the run, for each zone HTI, Uniformity of the three Air TCs, and Uniformity of the three Mass TCs. These are the measured values shown in the General tab tables.

• The HTI display is scaled from 0 to 1 for heated zones, and -1 to 0 for cooling zones
• The Uniformity displays will auto-scale based on the data in that run
• Double click the section to enlarge the display

Compare tab

This screen allows a comparison of the currently displayed run to another previous run. Only runs using the same oven configuration (same size and number of heated and cooling zones) and oven recipe can be compared.

The top left Profile 1 area shows the date/time of the current run being viewed. Select the Compare Profile 2 drop-down to display a menu of the available runs that can be compared. Select one from the list, then click on the Analyze button to the right to display the comparison of the two runs.

Select/Deselect TC Data to compare

By default, all TCs are selected. Deselect any TC you want to remove from the comparison and the display will automatically update with only the selected TC(s).

Comparison graphs

The top graph will display an overlay of the complete profile runs for the selected TC(s). A legend is shown on the right side of the graph for whichever TC(s) data is selected.

The bottom graph displays a plot of the variation or Delta T between the two runs for the selected TC(s). If upper/lower specifications were defined as part of the Process Window setup, those limits will be displayed on the graph. A legend is shown on the right side of the graph for whichever data is selected.

Double click on a graph to expand it to a larger size. Right click on either graph screen to open a menu of available tools such as an Examine line and Zoom functions.

Sub tabs on Compare screen

Run to Run Delta T

Average Delta displays an average of the variation in temperature across the entire data collection between the two selected runs Max Delta displays the single largest amount of variation (in degrees Celsius) between the two runs. A negative value would indicate that the current run is x degrees cooler than the compared run at that location. Time of Max Delta displays the point in the data collection where the Maximum Delta occurred. In the example above, it occurred at 260 seconds, which in this case was in the first cooling section.

Conveyor Speed

Delta displays the largest variation in measured conveyor speed between the two selected runs. A negative value would indicate the current run is x amount slower than the compared run.

HTI

Delta displays the variation in Heat Transfer Index for each zone between the two selected runs. A negative value would indicate the HTI in the current run is lower than compared run.

The HTI section will display bar charts representing the individual HTI values from the two runs being compared:

• Each zone will display two different shades of color representing the two runs Profile 1 in the darker shade and Profile 2 in the lighter shade
• Double-click the section to enlarge the display
• When holding cursor over an individual bar graph, a pop-up menu will display the HTI values of each run
• The heated zones are scaled from 0 up to 1, and the cooling zones are scaled from 0 down to -1

Uniformity Delta displays the variation in Uniformity for each zone between the two selected runs. A negative value would indicate the current run is lower than compared run.

The Uniformity section will display bar charts representing the difference in Uniformity calculations for each zone, from the two runs being compared.

• Each zone will display two different shades of color representing the two runs Profile 1 in the darker shade and Profile 2 in the lighter shade
• Double-click the section to enlarge the display
• When holding cursor over an individual bar graph, a pop-up menu will display the Uniformity values of each run

SPC Charting with SRA

The data collected from the SRA can be analyzed over time by using the SPC charting capabilities. See the SPC Charting section for details.

Updating the Process Window for multiple SRA profiles

You may have a situation where you need to update the Process Window across multiple profiles of the same product name. You can do this by using the Ctrl or Shift keys, and then selecting the desired profiles you want to update:

Click on the Apply new Process Window button at the bottom of the screen and a menu will display. Select the Process Window from the drop-down menu that you want to be saved to all the selected profiles, and then click the Green checkmark button. All selected profiles will be updated with the Process Window selected, and the Last Modified date/time stamps for each file will be updated to reflect when the change was made.

IMPORTANT:

• Changing the Process Window for a profile may result in a different PWI percentage calculation for that profile, depending on the specifications defined.
• You can only select profiles that were run on machines with a matching configuration same number of heated and cooling zones.
• You can only select a new Process Window that is linked to a matching machine configuration. For example, you cannot apply a PW that is configured for a 5 zone machine to profiles that were run in a 10 zone machine.

Contacting KIC

On the Web   You can find the latest KIC product news along with a library of useful information at our website: https://kicthermal.com or https://kic.cn

KIC Technical Support

KIC Tech Support is available by email:

USA: tech@kicmail.com

Europe: europe.tech@kicmail.com

Asia: asia.tech@kicmail.com

KIC Product Training

Contact KIC Customer Support by email, training@kicmail.com

KIC Sales

Contact KIC sales:

USA: sales@kicmail.com

Europe: europe.sales@kicmail.com

Asia: asia.sales@kicmail.com

China: asia.sales@kicmail.com

Find the KIC Representative in Your Area

Send an email or visit our web page to find a local representative.

Introducing the software

Used together with a profiler, this software provides all the tools you need for basic thermal profiling.  It lets you:

• Specify operating parameters
• Define individual process setups
• Monitor the status of your profiler hardware
• Graphically display profile data for analysis
• Manage data from multiple profiling runs

Optional programs

The functionality of the standard software can be enhanced by using the optional software programs:

• Navigator Power automatically finds the optimal oven setup for each product you profile.
• Auto-Focus Power calculates the ideal initial oven recipe to avoid typical oven setup problems.
• Statistical Process Control displays profile data to chart Process Capability Index (Cpk) values. 

These enhancement options are distributed on and activated from a software key a removable USB thumb drive that can be separately purchased from KIC.

Profilers

The software is compatible with several different hardware models:

1. SPS Smart Profiler
2. SRA Smart Reflow Analyzer
3. X⁵
4. K²

Some illustrations in this manual may reference the X⁵ profiler.  When using the software with the K² profiler references to that model will appear in the same locations.  The user interface is otherwise identical. Some functions are only available with the SPS Smart Profiler (See Run Profile Stacking). For specific information regarding your profiler, consult one of the following publications:

• SPS Smart Profiler Hardware Guide, (Publication Number PTG-330310-000)
• SRA Smart Reflow Analyzer Hardware Guide, (Publication Number SRA-330200-000)
• X⁵ Profiler Hardware Guide, (Publication Number EXP-337310-000)
• K² Profiler Hardware Guide, (Publication Number EXP-331310-000)

Installing the software

Minimum PC requirements

• 2GHz processor PC with 4GB RAM
• 5GB available storage
• Video 1024 x 768 / 16-bit color
• 1 available USB port (for Dongle key)
• 1 available USB port (for Profiler)
• For product compatibility with Windows operating systems, visit our website at https://kicthermal.com/support-download/os-compatibility-chart

Note: Additional powered USB ports may be needed for additional accessories.

Languages

The software supports the following languages:

The use of specific languages depends on the operating system:

• English, German, and Spanish can be run on any of the supported Windows operating systems.
• Japanese, Korean, Simplified Chinese, and Traditional Chinese cannot be used with English versions of Windows operating systems.
• To run the software in Japanese, the operating system must be Windows-Japanese version. 
• To run the software in Simplified or Traditional Chinese, the operating system must be Windows-Chinese version.

To install the software:

1. Insert the USB flash drive into a USB port on your computer.

2. Depending upon your computer setup, a dialog box may appear. If it does, select Open folder to view files. If a dialog box does not appear, use Windows Explorer to browse to the USB flash drive directory.

3. Double-click the installation file in the root directory to begin the installation and follow the instructions* for the installation program as prompted as the screens are displayed.

•   The software installation automatically adds a KIC folder to main Windows Start Menu.

*When installing the software over an existing Profiling Software 2G directory, the installation will automatically create a backup folder of the existing directory. A warning message will be displayed when selecting an existing directory, and a checkbox can be de-selected if you do not wish to create a backup. The name of the backup directory created will be C:\Profiling Software 2G_Old_MM-DD-YYYY.

During the installation process, you will encounter the following screen:

When the supplied USB software dongle is connected, or your license has been activated, and then click Continue, the software will identify what additional purchased options are available. When applicable, an additional prompt may appear regarding the configuration of those options.

If there is no USB software dongle or license present when clicking the Continue button, the software will continue the installation with the standard, default configuration.

Note: If you have a question regarding your hardware or software configuration, contact KIC Tech Support at tech@kicmail.com

Starting the software

To start the software:

Click on the software icon/filename.The main screen appears:     Click on one of the buttons to begin one of the software functions described below:

To end the software session:

1. Return to the main screen by clicking one of these buttons:

Hardware Status

Figure 9: Hardware Status

Oven Controller Shows the status of the connection between the software and any connected oven.  Contact KIC for details about connecting your reflow oven.

Profiler status panel Names the currently selected profiler and displays the following information:

• Profiler communication status

• COM port when connected.

• Temperature display for all connected thermocouples.

• Battery Voltage.

• Internal Temperature of profiler.

• Maximum Temperature Capability This value determines the maximum temperature that the profiler can read. 

Software Key Shows the status of any software key that is connected.  Displays the functions associated with the software key.

Product Image TC Mapping

This optional feature offers a method to attach an image of the board they are profiling, including the TC locations and descriptions, to the product data file. Many users have multiple test boards that they run profiles on, and sometimes create a brand-new profile board each time they run. This feature will help identify which board was actually profiled, its dimensions, and the specific locations of the attached TC s. The information will be saved as part of the profile data file and will be available to print out. This additional data will eliminate the guess work of placing TC s in the same place when recreating the profiling board.

Product TC locations

When the Product Image TC Mapping option is in use, this screen will appear after the Product Name and Process Information screen in the Run a Profile sequence.

Click the Browse button. This will open up a Windows directory where you will point to the location of the profile board image to include. A .bmp, .jpg, or .png can be selectedTip: Use a good quality photo for easier TC labeling and identification.
Select the total Number of TCs (minimum of 2 Air TC plus at least 1 product TC) being used during the profile and enter the product dimensions. Enter the product Length and Width dimensions. NOTE: If the Auto-Focus option is also enabled, these dimensions will automatically be carried over from the previous screen.
After uploading an image, click the Add TC Marker button to position a numbered mark on the image to identify the TC.When the Add TC Marker button is selected, it gives you the opportunity to select which specific TC number to start with. Select OK to continue or Cancel to close out of the tab.

Profiling Software 2G

User Manual

Version 4.9

Publication Number SFT-317000-000

Profiling Software 2G User Manual

Copyright 2024 KIC.  All rights reserved.  Patents pending.

16120 West Bernardo Drive

San Diego, CA  92127

Phone: +1 858 673 6050      Fax: +1 858 673 0085

A Division of Embedded Designs Inc.

This document contains information that is proprietary to KIC.  Said information, is copyrighted as is all associated software and hardware.  All rights are reserved. Patents are pending.

This document and the information contained in it may not be sold, duplicated, used, or disclosed, in whole or in part, except as specifically authorized in writing by KIC.  The information contained in this document and associated software is subject to change without notice.

There are no warranties with respect to the information contained in this document, express or implied, except as provided by written contract between KIC and the customer.

All KIC product names and logos are trademarks of Embedded Designs, Inc. All other trademarks used herein are the property of their respective owners.

Software Licensing Agreement and Product Warranty

The KIC software is subject to the following license terms and conditions.

1. KIC SOFTWARE LICENSE

11. This is a software license granted by KIC, mailing address 16120 West Bernardo Drive San Diego, CA 92127. 
12. The KIC software is licensed to you as the end user and is not sold.
13. The KIC software is copyrighted material. 
14. The KIC software is licensed for use with one or more pieces of associated hardware that together constitute a thermal process management system.  This license allows you to use the software with the purchased system.  You must purchase additional copies of the software if used with additional system hardware.
15. You may not change, modify, decompile, disassemble, or otherwise reverse engineer the licensed software or any associated hardware.

2. LIMITED WARRANTY

21. KIC warrants that the system hardware and software are free from defects in material and workmanship under normal use.  KIC warrants that the system as a whole will perform substantially in accordance with the specifications set forth in the documentation provided with it.
22. Warranty regarding rated temperature:  Components of the system hardware are rated by KIC for proper performance up to a specified maximum temperature.  Any component that KIC determines to have been exposed to temperatures higher than the rated temperature is not covered under this warranty.
23. Start of the Warranty period.  The warranty period begins the day the KIC product is delivered to you as the first customer.
24. Obligations of KIC during The warranty period:

241. Return for complete refund:  If, within the first thirty (30) days after the start of the warranty, the customer returns, for any reason whatsoever, any of the purchased hardware or software in its original condition, KIC will refund the associated money paid and accept the return as payment for any money owed.
242. Replacement:  Within the first year of the start of the warranty, KIC will replace, on an exchange basis and without additional charge, any product proven defective in materials or workmanship.
243. Correction of software:  KIC will either replace or repair, without additional charge, any software that does not perform in substantial compliance with its documented specifications.  In the foregoing circumstances, KIC will deliver either corrective code or a corrected copy of the software.
244. Final Remedy:  If KIC is unable to replace defective media or provide a corrected copy of the software within a reasonable amount of time, KIC will either replace the software with a functionally similar program or refund the license fees paid for use of the software.

25. Exclusion of Other Warranties

251. KIC does not warrant that the functions contained in the software will meet your requirements or that the operation of the software will be uninterrupted or error free.  The Warranty does not cover any copy of the software that has been altered or changed in any way by you or others.  KIC is not responsible for problems caused by changes in the operating characteristics of the computer hardware or operating system which are made after delivery of the software.
252. EXCEPT WHERE LIMITED BY LOCAL JURISDICTIONS, KIC SHALL NOT IN ANY CASE BE LIABLE FOR SPECIAL, INCIDENTAL, CONSEQUENTIAL, INDIRECT OR OTHER SIMILAR DAMAGES ARISING FROM ANY BREACH OF THESE WARRANTIES EVEN If KIC OR ITS AGENT HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

26. Other Conditions

261. The warranties set forth above are in lieu of all other warranties, whether oral, written or implied, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR USE. the remedies set forth above are the customer s sole and exclusive remedies.  Only an authorized officer of KIC may make modifications to this warranty, or additional warranties binding on KIC.  Accordingly, additional statements such as advertising, collateral or presentations, whether oral or written, do not constitute warranties by KIC and should not be relied upon as such.  This warranty gives you specific legal rights, and you may have other rights, which vary by state and/or country.

3. LIMITATION OF LIABILITY

31. In no case shall KIC’s liability exceed the license fees paid for the right to use the licensed software or One Hundred Dollars ($100.00), whichever is greater.

Table of Contents

Profiling Temperature vs. Time processes

The Temperature vs. Time application lets you profile a variety of thermal processes beyond the more typical soldering uses.  These include rework, batch curing, environmental temperature cycling, and extreme temperature (‑150 to 1050 C) applications.  It can be used with any thermal process or experiment that can benefit from plotted temperature/time data.

Temperature vs. Time (T Vs.T) profiling differs from other applications in the following ways:

• Profilers don t use temperature triggers to start and stop the profile.  These actions are performed manually.

• TC #1 is not used as an Air-TC and operates as a normal TC.  TC #1 can be included in Process Window calculations.  Data for TC #1 is displayed on the profile graph.  Using any other application type, it is not.

• The software prediction capabilities by design are not compatible with T Vs. T profiles.  Neither Navigator or Auto-Focus work on T Vs. T profiles.  PWI is calculated for each profile.

• The datalogger profiler (or wireless unit used as a datalologger) needs to be connected to the communication cable when you initiate the T Vs. T profile and when you stop it. 

• Some profilers can utilize the RF option for wireless T Vs. T profiles. 

• Using T Vs. T, users can measure negative temperatures.  Because temperature triggers are not used, the software can display data as low as -150C.

Global Preferences

Profiling hardware Even if your profiler has RF capability but you run it as a datalogger, it still needs to be connected to the communication cable when you initiate the T Vs. T profile and when you stop it.

Auto Focus tab The Auto Focus feature by design is not compatible with T Vs. T profiles.

Note:  If you have made any changes, be sure and select the green check mark button to save those changes when exiting the Global Preferences screen.

To run a temperature vs time process profile:

1. From the main screen, click the Run a Profile button.

The Name Product and Select Process Window screen appears.

2. Select your Process Window from the pull down list.

3. From the Application pull down, select Temperature Vs Time.

Note: To have valid profile data in a Time Vs Temperature application, it is imperative that you correctly specify the application type.

4. Select from the pull down or enter an oven name in the Oven Name field.

5. Add any appropriate production notes in the Profile Description field that you want stored with the profile.  (These can be edited later.)

6. Click the Next arrow to proceed.

The software guides you through the command input screens needed to run a profile.

Selecting the thermocouples and starting a profile

This screen displays the live readings for all thermocouples connected to your profiler. Select the thermocouples by clicking the check box next to each TC number. Make sure the profiler has fresh batteries and is powered on. See Figure 88. 

Selecting Thermocouples – To select a thermocouple, check the box next to the thermocouple number.  The live temperatures are displayed beneath each thermocouple label.

Thermocouple Labels – Optionally you can check the box to include thermocouple labels.  When this box is checked you can type a text label for each selected thermocouple.  20 character maximum.

Figure 88: Run a Profile Screen #2 Time vs. Temperature

Note: If the selected Process Window has Separate Specs for TCs, then you must return to the Process Window-Edit Specs screen in order select/deselect TCs or change their labels.

Expected profile length This value controls the X-Axis on the profile graph.  Make sure to enter enough time to complete your profile.  Otherwise the profile plot will stop as soon as the Expected profile Length is achieved.  Data outside this time limit will not be displayed.

Note: to decrease the number of samples, enter a longer Expected Profile Length

Once you have selected your thermocouples, you are ready to profile.

Make sure your profiler hardware is properly connected to the computer.  You will be able to view the live readings for each selected thermocouple.  If you do not see the live readings, then your profiler hardware is not connected properly.

Recheck the connections.  Temperature vs. Time profiles cannot begin until your profiler is connected via the cable, and communication established.

Select the Start Profile (green traffic light) button to begin profiling.  The profile will begin at this point.

The software requires that the selected thermocouples read valid temperatures below the Maximum product temperature at start of profile as set in the Global Preferences screen.  The default setting is 31 C/88 F.

Note: If any of the selected thermocouples read too high, this message will appear. See Figure 89. 

Figure 89

When the software detects valid temperatures for all of the selected thermocouples, it will allow you to start the profile.

IMPORTANT NOTE: All profilers have a maximum operating temperature that, to avoid damage, should never be exceeded.  See the product datasheet for temperature tolerance information.

Viewing the live profile graph display

The Live Profile Graph display will show the profile plot on the graph for the current profile that is running. See Figure 90. 

Figure 90: Live Profile Graph Display

While the profiler is in the oven, and until the run has ended, the software will continue to display the Live Profile Graph.  The Description tab at the top of the screen is inaccessible.

• The live profile is plotted on the graph

• The current temperatures for each thermocouple and the Delta between them are displayed in a small window in the upper-left hand corner of the profile graph.  The elapsed time is also displayed.

Viewing the profile and its statistics

Figure 93: Profile Graph Display Time vs. Temperature

The Profile screen General Tab displays the product name and profile start time at the top of the screen. The profile, profile statistics and PWI are also displayed. See Figure 93. 

Profile view To maximize the profile display, double click inside the profile graph area.  The profile graph will change and be displayed in a full screen format.  Double click again to return to normal view.

Statistics view To maximize the Statistics view, double click inside the Statistics table area.  The Statistics will change and be displayed in a full screen format.  Double click again to return to normal view.

Description tab

Graph Controller

The Graph Controller allows you to modify the view of the profile graph. To open the Graph Controller, click on the TC column header or click, anywhere just outside the profile graph. See Figure 95.  Auto Scale The Auto Scale feature will automatically adjust the X and Y axis scales to fit all of the data in the profile graph.  When the Auto Scale feature is disabled, you must manually input the minimum and maximum scale settings for the X and Y axis scale of the profile graph. Selecting thermocouples to view The TCs section is a list of the thermocouples used for the profile.  By selecting All you are selecting that all the thermocouples used for the original profile will be displayed on the profile graph.  In the event that you wish to view the profile without one or more thermocouples, you can deselect individual thermocouples, or deselect the All check box, and choose only the thermocouples you wish to view.

Figure 95: Graph Controller Time vs. Temperature

Excluding disconnected thermocouples

If a thermocouple becomes disconnected during the profile, the profile results (PWI) may be affected due to an erratic reading.  In the event a single or multiple thermocouples become disconnected from the product during the profile, you can deselect the affected thermocouple(s).  The software will recalculate the PWI and update the profile statistics based on the remaining thermocouples selected.  You must select at least one product thermocouple.

Grid Enables/disables the view of the X and Y Axis scales.

Reference lines Clicking this check box enables the view of Reference Lines displayed on the profile graph.  These lines represent any temperatures referenced in the selected Process Window.  When you use separate thermocouple specs, the Reference Lines check box is disabled, and no lines appear on the graph.

Zero decimal When viewing the Pointer tool, this setting enables or disables the decimal display.  When unchecked, the software will display one decimal point.

Internal temp Enables the view of the profiler s internal temperature profile plot on the graph. 

Display Detailed PWI This default-selected checkbox enables Process Window Index (PWI) percentage values to appear on profile graph displays.  (See Appendix C: Using the Process Window Index to quantify thermal profile performance)

Graph Option menu

Automatic calculation of Delta T + Delta (or range) for all stats

The software will automatically calculate, and display in the statistical chart, the Delta for both the original and predicted profile data for all TCs for all Statistics. See Figure 97. This is the range of the highest to the lowest value for any given specification. This information is strictly being displayed and is not factored in to the PWI value and is not used in the Navigator or Auto-focus calculations. 

Move TC line

Figure 99: Move TC Line

Exiting the profile screen

Saving changes to the profile

Saving changes to the Process Window

Note: These 2 messages will only appear if changes have been made while viewing the profile.

Profiling thermal curing processes

The software can be used to profile thermal processes that cure epoxy and other thermosetting polymers. The procedure is similar to that used with reflow soldering, but may involve creating specifications aimed at your specific cure application

To run a cure process profile:

1. From the main screen, click the Run a Profile button.

The Name Product and Select Process Window screen appears.

2. Select your Process Window from the pull down list.

3. From the Application pull down, select Cure.

Note: To have valid profile data in a cure application, it is imperative that you correctly specify the application type.

4. Select from the pull down or enter an oven name in the Oven Name field.

5. Add any appropriate production notes in the Profile Description field that you want stored with the profile.  (These can be edited later.)

6. Click the Next arrow to proceed.

The software guides you through the command input screens needed to run a profile.

Profiling with a wave solder machine

KIC profilers can be used to measure thermal profiles in a wave solder machine.  The process is very similar to profiling a solder reflow oven.  The software guides you through the process.

Note: KIC does not recommend installing this software on an oven controller PC if you plan to run wave solder profiles. 

Wave Surfer profiling fixture

Wave solder profiling

This section will outline the steps necessary to setup and run a wave solder profile using your profiler and the software.  This section is written assuming you have a basic understanding of the software and its functions before attempting to run profiles on a wave solder machine.

Global Preferences

Unit of measure Wave solder machines generally use the Fahrenheit scale for preheat and solder pot temperature measurements.  If necessary change the temperature units to Fahrenheit.

Process Window

The software does not contain a list of fluxes or materials used specifically for wave soldering; only a list of solder pastes generally associated with solder reflow. Users defining a Process Window for a wave solder process may have to define their own specifications.

Select the line item at the top of the list – Define your own spec – from the Solder paste Menu. You will be automatically directed to the Edit Specs window where you can enter your unique process specifications. Enter your process specifications, when finished; select the green check button.

Including the wave portion of the profile

Select the Wave checkbox to activate the wave specific process specs.  When the Wave checkbox is checked the software will display profile statistics for the wave portion of the profile when viewing the completed or saved profile.  See Figure 49. 

Figure 49

If you have followed the above directions, you should be looking at the Process Window screen.  If you are satisfied with the settings and wish to apply these specifications to all the thermocouples used, type a descriptive name in the top field and select the green check button.  Select Yes when prompted to save the Process Window file.

If you want to use different specifications for one or more thermocouples, you can do so.

Note: When running wave solder profiles with the wave on, the profilers use two wave TCs in addition to the Air TC to collect wave specific data. The Wave TCs will connect to channels #2 and 3 on the profiler. See the Connecting Wave TCs section of this manual for details, page 60.

Running a wave solder profile

Figure 50: Run a Profile Screen

• Select your Product Name from the list.  If you are profiling a new product type the name.

• Select your Process Window from the list.

• Select your process type from the Applications list.  The software profile and prediction results are based on this setting.  It is imperative that your select the correct Application type.  Failing to do so can affect the profile results.  For wave solder select to run the profile with the wave On or Off using extra thermocouples to measure wave characteristics such as Dwell Time, Parallelism, and solder temperature.  Select the Wave Profile option to run a profile without the wave characteristics data .

• If you select Wave On, the software will utilize two wave TCs in addition to the Air TC.  The Wave TCs will measure: wave Dwell Time and Parallelism when profiling with the wave on.  The Air TC must be positioned to run through the wave(s).

• If you select Wave On, the software will display preheat and wave profile data, but offer prediction results only for the pre-heat section of the profile.  The Air TC must be positioned to run through the wave(s).

• If you select Wave Off, the software will not display wave charachteristics data. The Air TC must be positioned to NOT run through the wave(s).

• If you select Wave Profile, The Air TC must be positioned to run through the wave(s).

If you purchased the Wave Surfer, you can select Wave Surfer from the Applications list.

• Select your oven name from the list. If you re profiling on a new oven or machine, type the name in the Oven Name field.

• Optionally you can type notes or descriptions for this profile in the Profile Description field. These notes will be stored with the profile and can be edited later if necessary.
• When you are finished with your selection, choose the Forward Arrow button to proceed. See Figure 50.

Zone length, minimum and maximum temperature settings

Customize Wave Solder Machine Configuration Many wave solder machines have non-uniform zone configurations such as different quantities of top and bottom preheaters. If desired, you have the ability to specify the exact layout of your machine.   To enable this function, exit the software and run the PSConfig.exe utility program from the C:\Profiling Software 2G directory.   Select the Use Wave Machine Configuration Tab and then OK. A message will display alerting you that the configuration utility will need to be restarted. Choose OK.

Restart the PSConfig.exe and a new Machine Configuration tab will appear.   Wave Solder Machine Name: Enter a new name for your wave solder machine or select an existing wave solder machine name to modify the configuration.   Units: Selections for various settings.   Number of Preheaters: For preheaters, enter the maximum number of zones (for the Top or Bottom). So, if there are 4 bottom preheaters and 1 top, enter 4.   Zone Order: Allows you to define the zone numbering display in the software to match your machine layout.   TOP/BOTTOM: Select via checkbox which zones have top and/or bottom preheaters. When enabled, you can also define the units for the temperature setpoint C, F, or %. Enter the length of each of the preheaters, as well as the Minimum and Maximum allowable setpoint in that zone.   Wave: Select the number of waves used in the machine, and the name of each wave in the profile display.

Distance from end of last preheat zone to the main wave: Enter distance to the beginning of the actual main solder wave.

Distance from the start of Wave 1 to the start of Wave 2: This entry will only be active if the number of waves is set to 2. Enter distance to the beginning of the chip wave (Wave 1) to the beginning of the main wave (Wave 2). This is where the product would first make contact with each wave.

Click Apply or OK to save your changes.

Any wave solder machine name that is configured within this utility will show up in the Oven Name list on the first RUN A PROFILE screen.

NOTE: When the Wave Machine Configuration tab is enabled, you can only create/define new Wave Solder machine configurations through this utility. If you try to enter a new Wave Solder machine name in the oven drop-down menu on the Run A Profile screen, a message will display letting you know to use this configuration tab:

Entering temperature setpoints and conveyor speed

Connecting the TCs

Wave Surfer

Connecting wave TCs

It is very important to follow these directions.

• Plug the Left-Wave TC into the #2 slot of the profiler.

• Plug the Right-Wave TC into the #3 slot of the profiler.

When you have properly connected your Wave TCs, select the Forward Arrow button to proceed.

Figure 56: Connecting wave TCs cont

Product TCs are connected to the product in key locations across the product.  The selected locations need represent the highest and lowest- mass areas of the product or even specific temperature sensitive components.

Once you have connected your Product TCs to your product, connect them to the profiler stating with slot or TC #4.

Select the Forward Arrow button to continue.

Figure 57: Connecting product TCs

Select the Help Measurement (Tape Measure Help) button for an example of how to correctly measure the distance from the Air TC. See Figure 59.

Figure 59: Wave-On TC measurements

• Yes The software will prompt you to put the profiler and the board in to the oven.

• No The software will ask if the oven is getting closer to the setpoints.
  See Figure 62. 

 

 

• Yes The software will return to previous screen to wait untill the oven is ready, oven setpoints within 2.0 C/3.6 F.

• No The software will ask you to change the oven setpoint temperatures to the temperatures that the control thermocouples are currently reading, and then press OK.

Figure 61

Figure 62

The Dwell Time is measured by the Wave TCs.  The Parallelism is the measured time difference between when the Wave TC-Left, and Wave TC-Right hit the wave.

The Solder Temperature setpoint is input by you before the profile when entering oven setpoint information.  The solder temperature value is measured by the Air TC during the profile.

Figure 67: Wave Information

Auto scale The Auto Scale feature will automatically adjust the X and Y axis scales to fit all of the data in the profile graph. When the Auto Scale feature is disabled, you must manually input the minimum and maximum scale settings scale of the profile graph.

TCs The TCs section lists the thermocouples used for the profile. In the event that you wish to view the profile without one or more thermocouples, you can deselect individual thermocouples, or deselect the All check box, and choose only the thermocouples you wish to view. In the event a single, or multiple thermocouples become disconnected from the product during the profile, you can deselect the affected thermocouple(s). The software will recalculate the PWI and update the profile statistics based on the remaining thermocouples selected. You must select at least one product thermocouple.

Figure 74: Graph Controller Wave-On

Examine line

The Examine line feature displays the temperature for the location of the pointer on the profile graph. See Figure 76.

Figure 75: Graph Option menu

• The first column is the actual temperature for each TC.
• The second column is the temperature of the predicted profile data
• The Delta T for both actual and predicted TC data.
• The time during the profile at which the pointer is placed

Automatic calculation of Delta T + Delta (or range) for all stats

The software will automatically calculate, and display in the statistical chart, the Delta for both the original and predicted profile data for all TCs for all Statistics.  This is the range of the highest to the lowest value for any given specification.  This information is strictly being displayed and is not factored in to the PWI value and is not used in the Navigator or Auto-focus calculations. 

Figure 76: Graph Pointer

Zoom

You can also view the profile by zooming in to get a better view of a particular area of the profile display. Right-click on the graph, this will bring up a menu. See Figure 77. Select the Zoom and a chart will appear on the left side of the graph.

Figure 77: Graph Option Menu – Wave

Move TC line

The Move TC line feature allows the user to manually move the thermocouple plot on the profile graph. This is used to fine-tune the profile or make corrections in the event the software did not properly display the plot. See Figure 79.

Select the thermocouple you wish to move and then click and drag the highlighted plot and move it to the desired location on the profile graph. See Figure 80. 

Figure 79: Graph Option Menu Move TC Line

Move zone line

The Move Zone line feature allows the user to manually move the zone separation lines on the profile graph.  This is used to fine tune the profile or make corrections in the event the software did not properly display the zones. 

Select to move the first line (Zone beginning) or the Last line (Zone ending) (See Figure 81) and then click and drag it to the desired location on the profile graph.

Figure 81: Zone Resize

Move preheat and wave dividers

The Move Preheat and wave divider feature allows the user to manually move the Preheat and Wave locations on the profile graph. This is used to fine tune the profile or make corrections in the event the software did not properly display these points. Place the cursor over the blue wave divider line and then click and drag it to the desired location on the profile graph. See Figure 84.

Figure 83: Move Preheat and Wave Divider

Zone Resize

Select to move the first line (Zone beginning) or the last line (Zone ending and then click and drag it to the desired location on the profile graph. See Figure 85.

Figure 85: Graph Option Menu Zone Resize

Reset

The Reset feature will reset the profile and undo any changes you have made to the graph using the Graph Option Menu. Select the TC Line, or Zone Line option. See Figure 86.

Figure 86: Graph Option Menu -Reset

When using the Wave Solder-Wave On application for profiling, enabling this selection changes the method used to determine the contact time (dwell) of the wave TC s attached to the bottom side of the profile board.

NOTE: Changing this setting is NOT typically recommended and is only for specialized use.

Use Alternate Parallelism Calculation

When using the Wave Solder-Wave On application for profiling, the software calculates both Dwell Time and Parallelism. By default, the parallelism value displayed is the Left Dwell Time minus the Right Dwell Time.

When this alternate method is selected, the parallelism value displayed is the difference in time between when the left and right-side wave TCs first contact the wave.

Use Conveyor Speed Measurement from bottom side TCs

If you attach TCs to the bottom side of your profile board, you can use this function to perform a conveyor speed measurement during profiling. The software will use the following parameters to perform the calculation:

• Selection of channels on the profiler with bottom-side TCs connected
• Specified distance between the bottom side TC locations (must be 3 inches minimum)
• Difference in contact time with the solder wave of the two selected TCs

Run A Profile

On the first screen, a checkbox will display for Enable Conveyor Speed Measurement . Select this box to have the speed calculation performed. The selection will be saved per product.

Select TC Screen

At the Select TC screen, you will find a new drop-down menu in the lower left for selecting the TCs to be used for the speed calculation.

The following apply:

• Only two (2) TCs can be selected
• They must be bottom-side TCs
• There must be at least three (3) inches distance (length wise) between selected TCs

Profile Graph Display

When the profile is completed and downloaded, the data for Dwell time, Parallelism, Solder Pot temperature, and Conveyor Speed will be displayed in a window on the graph: